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Invention Grant
US09576839B2 Substrate carrier arrangement, coating system having a substrate carrier arrangement and method for performing a coating process 有权
基板载体布置，具有基板载体布置的涂布系统和用于进行涂布过程的方法

Substrate carrier arrangement, coating system having a substrate carrier arrangement and method for performing a coating process
Abstract:
A substrate carrier arrangement (10, 11) for a coating system (12) is provided, comprising a carrier (1) which comprises at least one support region (3) having a support surface (30), on which a substrate support (2) is arranged, and which support region comprises in the support surface (30) at least one first and one second gas inlet (4, 5), wherein the first gas inlet (4) is at a smaller distance from a center (M) of the support surface (30) than the second gas inlet (5) and wherein the first and second gas inlet (4, 5) comprise mutually independent gas feeds (40, 50) which are arranged to supply gases having mutually different thermal conductivities. A coating system comprising a substrate carrier arrangement and a method for performing a coating process are also provided.
Abstract(Chinese):

提供了一种用于涂层系统（12）的衬底载体布置（10,11），其包括载体（1），所述载体（1）包括至少一个具有支撑表面（30）的支撑区域（3），衬底支撑件 ），并且所述支撑区域在所述支撑表面（30）中包括至少一个第一和第二气体入口（4,5），其中所述第一气体入口（4）距离中心（M）更小的距离， 所述第一和第二气体入口（4,5）包括彼此独立的气体进料（40,50），所述气体进料被配置成供应具有相互不同热导率的气体。 还提供了一种包括基板载体装置和用于执行涂布工艺的方法的涂覆系统。

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