Invention Grant
- Patent Title: Water soluble mask formation by dry film lamination
- Patent Title (中): 通过干膜层压形成水溶性面膜
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Application No.: US14563901Application Date: 2014-12-08
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Publication No.: US09583375B2Publication Date: 2017-02-28
- Inventor: Wei-Sheng Lei , James S. Papanu , Brad Eaton , Ajay Kumar
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor Zafman LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/78 ; H01L21/67 ; H01L23/31 ; H01L21/308 ; H01L21/3065 ; H01L21/56
Abstract:
Methods and systems for forming water soluble masks by dry film lamination are described. Also described are methods of wafer dicing, including formation of a water soluble mask by dry film lamination. In one embodiment, a method involves moisturizing an inner area of a water soluble dry film. The method involves stretching the water soluble dry film over a surface of the semiconductor wafer, and attaching the moistened inner area of the stretched film to the surface of the semiconductor wafer. A method of wafer dicing may further involve patterning the water soluble dry film, exposing regions of the semiconductor wafer between the ICs, and etching the semiconductor wafer through gaps in the patterned water soluble dry film.
Public/Granted literature
- US20150294892A1 WATER SOLUBLE MASK FORMATION BY DRY FILM LAMINATION Public/Granted day:2015-10-15
Information query
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