Invention Grant
US09586291B2 Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release
有权
用于将处理器晶片接合到器件晶片并实现中波长红外激光消融释放的粘合剂
- Patent Title: Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release
- Patent Title (中): 用于将处理器晶片接合到器件晶片并实现中波长红外激光消融释放的粘合剂
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Application No.: US14226953Application Date: 2014-03-27
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Publication No.: US09586291B2Publication Date: 2017-03-07
- Inventor: Bing Dang , John U. Knickerbocker , Eric Peter Lewandowski , Cornelia Kang-I Tsang
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC
- Current Assignee: GLOBALFOUNDRIES INC
- Current Assignee Address: KY Grand Cayman
- Agency: Scully Scott Murphy and Presser
- Agent Frank DiGiglio
- Main IPC: H01L21/302
- IPC: H01L21/302 ; B23K26/36 ; G01R31/26 ; H01L21/683
Abstract:
Methods are provided to form adhesive materials that are used to temporarily bond handler wafers to device wafers, and which enable mid-wavelength infrared laser ablation release techniques to release handler wafers from device wafers.
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