Invention Grant
US09586810B2 Polymeric substrate having an etched-glass-like surface and a microfluidic chip made of said polymeric substrate
有权
具有蚀刻玻璃状表面的聚合物基材和由所述聚合物基材制成的微流体芯片
- Patent Title: Polymeric substrate having an etched-glass-like surface and a microfluidic chip made of said polymeric substrate
- Patent Title (中): 具有蚀刻玻璃状表面的聚合物基材和由所述聚合物基材制成的微流体芯片
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Application No.: US13811800Application Date: 2011-08-01
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Publication No.: US09586810B2Publication Date: 2017-03-07
- Inventor: Gerda Fuhrmann , Gabriele Nelles , Silvia Rosselli , Nikolaus Knorr , Alfred Paris , Maria Kaufmann , Georg Bauer
- Applicant: Gerda Fuhrmann , Gabriele Nelles , Silvia Rosselli , Nikolaus Knorr , Alfred Paris , Maria Kaufmann , Georg Bauer
- Applicant Address: JP Tokyo AT Anif
- Assignee: Sony Corporation,Sony DADC Austria AG
- Current Assignee: Sony Corporation,Sony DADC Austria AG
- Current Assignee Address: JP Tokyo AT Anif
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: EP10007998 20100730
- International Application: PCT/EP2011/003855 WO 20110801
- International Announcement: WO2012/013361 WO 20120202
- Main IPC: B81B1/00
- IPC: B81B1/00 ; B01L3/00 ; B81C3/00 ; C08J7/04 ; C08J7/06 ; C08J7/12 ; B32B3/02 ; B32B37/14 ; B05D1/00 ; C23C16/04 ; B81C1/00 ; C08L83/04
Abstract:
The present invention relates to a polymeric substrate having a glass-like surface, in particular an etched-glass-like surface and to a chip made of at least one such polymeric substrate. The present invention also relates to a method of providing a polymeric substrate with an etched-glass-like surface. Moreover, the present invention relates to a kit for manufacturing a chip using such polymeric substrate. Moreover, the present invention relates to the use of a polymeric substrate having a glass-like surface, in particular an etched-glass-like surface for manufacturing a chip.
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