Invention Grant
- Patent Title: Electronic device handling apparatus and electronic device testing apparatus
- Patent Title (中): 电子装置处理装置和电子装置试验装置
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Application No.: US14523009Application Date: 2014-10-24
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Publication No.: US09588142B2Publication Date: 2017-03-07
- Inventor: Toshiyuki Kiyokawa , Koya Karino , Daisuke Takano
- Applicant: ADVANTEST CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ADVANTEST CORPORATION
- Current Assignee: ADVANTEST CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Main IPC: G01R1/067
- IPC: G01R1/067 ; G01R1/073 ; G01R31/26

Abstract:
Provided is an electronic device handling apparatus capable of increasing the number of simultaneous measurements while suppressing the increase in cost. An electronic device handling apparatus, which moves bare dies relative to a probe card, includes: a thermal head which includes a plurality of holding regions each of which holds the bare die and has openings; at least one lift unit which is movably held by the thermal head so as to correspond to the holding regions and is able to advance and retreat through the openings; a moving device which moves the thermal head; and a fixed arm which is able to support the one lift unit.
Public/Granted literature
- US20160116503A1 ELECTRONIC DEVICE HANDLING APPARATUS AND ELECTRONIC DEVICE TESTING APPARATUS Public/Granted day:2016-04-28
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