Invention Grant
- Patent Title: Lens module applied to camera
- Patent Title (中): 镜头模块适用于相机
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Application No.: US14601607Application Date: 2015-01-21
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Publication No.: US09591287B2Publication Date: 2017-03-07
- Inventor: Yin-Dong Lu , Han-Yi Kuo
- Applicant: HIMAX TECHNOLOGIES LIMITED
- Applicant Address: TW Tainan
- Assignee: HIMAX TECHNOLOGIES LIMITED
- Current Assignee: HIMAX TECHNOLOGIES LIMITED
- Current Assignee Address: TW Tainan
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Main IPC: H04N3/14
- IPC: H04N3/14 ; H04N5/225 ; H04N13/02 ; G02B13/00

Abstract:
A lens module includes a first wafer level lens group, a second wafer level lens group, a first sensor, and a second sensor. The first wafer level lens group has a first optical axis. The second wafer level lens group has a second optical axis. The first optical axis is parallel with the second optical axis, and the first wafer level lens group and the second wafer level lens group are integrally formed. The first sensor is disposed corresponding to the first wafer level lens group, and the first sensor is disposed on the first optical axis. The second sensor is disposed corresponding to the second wafer level lens group, and the second sensor is disposed on the second optical axis.
Public/Granted literature
- US20160212407A1 LENS MODULE Public/Granted day:2016-07-21
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