Invention Grant
US09593272B2 Silica for CMP, aqueous dispersion, and process for producing silica for CMP
有权
用于CMP的二氧化硅，水分散体和用于制备CMP的二氧化硅的方法
- Patent Title: Silica for CMP, aqueous dispersion, and process for producing silica for CMP
- Patent Title (中): 用于CMP的二氧化硅，水分散体和用于制备CMP的二氧化硅的方法
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Application No.: US14904565Application Date: 2014-07-10
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Publication No.: US09593272B2Publication Date: 2017-03-14
- Inventor: Masahiro Nakamura , Ryuji Ishimoto
- Applicant: TOKUYAMA CORPORATION
- Applicant Address: JP Yamaguchi
- Assignee: TOKUYAMA CORPORATION
- Current Assignee: TOKUYAMA CORPORATION
- Current Assignee Address: JP Yamaguchi
- Agency: Cantor Colburn LLP
- Priority: JP2013-153281 20130724
- International Application: PCT/JP2014/068450 WO 20140710
- International Announcement: WO2015/012118 WO 20150129
- Main IPC: C09K13/00
- IPC: C09K13/00 ; C09K3/14 ; B24B37/00 ; H01L21/321 ; C01B33/18 ; B24B37/04
Abstract:
To reduce scratches during polishing while ensuring an appropriately high polishing rate, provided are a silica for CMP satisfying the following (A) to (C), an aqueous dispersion using a silica for CMP, and a method of producing a silica for CMP: (A) a BET specific surface area of 40 m2/g or more and 180 m2/g or less; (B) a particle density measured by a He-gas pycnometer method of 2.24 g/cm3 or more; and (C) a coefficient of variation in primary particle diameter calculated by TEM/image analysis of 0.40 or less.
Public/Granted literature
- US20160177155A1 SILICA FOR CMP, AQUEOUS DISPERSION, AND PROCESS FOR PRODUCING SILICA FOR CMP Public/Granted day:2016-06-23
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