Invention Grant
- Patent Title: High-conductivity bonding of metal nanowire arrays
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Application No.: US15249535Application Date: 2016-08-29
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Publication No.: US09601452B2Publication Date: 2017-03-21
- Inventor: John A. Starkovich , Edward M. Silverman , Jesse B. Tice , Hsiao-Hu Peng , Michael T. Barako , Kenneth E. Goodson
- Applicant: Northrop Grumman Systems Corporation , The Board of Trustees of the Leland Stanford Junior University
- Applicant Address: US VA Falls Church US CA Stanford
- Assignee: Northrup Grumman Systems Corporation,The Board of Trustees of the Leland Stanford Junior University
- Current Assignee: Northrup Grumman Systems Corporation,The Board of Trustees of the Leland Stanford Junior University
- Current Assignee Address: US VA Falls Church US CA Stanford
- Agency: Patti & Malvone Law Group, LLC
- Main IPC: H01L23/00
- IPC: H01L23/00 ; B23K1/00 ; B23K20/02 ; C25D3/30 ; C25D3/48 ; C25D5/02 ; C25D5/48 ; C25D7/06 ; C25D9/02 ; B82Y30/00 ; H01L23/373
Abstract:
A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.
Public/Granted literature
- US20160372438A1 HIGH-CONDUCTIVITY BONDING OF METAL NANOWIRE ARRAYS Public/Granted day:2016-12-22
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