Invention Grant
- Patent Title: Tool for catching IC package
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Application No.: US15009849Application Date: 2016-01-29
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Publication No.: US09604348B2Publication Date: 2017-03-28
- Inventor: Heng-Kang Wu , Quan Wang , Tzu-Li Chu , Fu-Jin Peng
- Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Applicant Address: KY Grand Cayman
- Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Current Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Current Assignee Address: KY Grand Cayman
- Agent Wei Te Chung; Ming Chieh Chang
- Priority: CN201510061905 20150206
- Main IPC: H05K3/30
- IPC: H05K3/30 ; B25B9/02

Abstract:
A tool for catching an IC package comprises a main body, a plurality of operation arms and a plurality of clamping arms. The main body has a base and a plurality of lateral portions rotating relative to the base. The operation arms each extends upwardly from a top portion of a corresponding lateral portion. The clamping arms each extends downwardly from a lateral portion and is formed with a clasping portion at a free end thereof, the clasping portion has a latching slot. The operation arms bring the lateral portions to rotate inwardly and open the clamping arms.
Public/Granted literature
- US20160229048A1 TOOL FOR CATCHING IC PACKAGE Public/Granted day:2016-08-11
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