Invention Grant
- Patent Title: Configurable pressure design for multizone chemical mechanical planarization polishing head
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Application No.: US14470852Application Date: 2014-08-27
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Publication No.: US09610672B2Publication Date: 2017-04-04
- Inventor: Jeonghoon Oh , Steven M. Zuniga , Andrew Nagengast , Samuel Chu-Chiang Hsu , Gautam Shashank Dandavate
- Applicant: Applied Materials, Inc.
- Applicant Address: unknown Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: unknown Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/306
- IPC: H01L21/306 ; B24B37/10 ; B24B37/11 ; B24B37/30
Abstract:
A polishing head for chemical mechanical planarization is provided. The polishing head includes a housing and a flexible membrane secured to the housing. At least a first, second, and third pressurizable chamber are disposed in the housing and each chamber contacts the flexible membrane. A first pressure delivery channel couples to the first chamber. A second pressure delivery channel couples to the third chamber. A first pressure feed line couples the first pressure delivery channel to the second chamber. A second pressure feed line couples the second pressure delivery channel to the second chamber. A first manually movable plug interfaces with the first pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber. A second manually movable plug interfaces with the second pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber.
Public/Granted literature
- US20160059377A1 CONFIGURABLE PRESSURE DESIGN FOR MULTIZONE CHEMICAL MECHANICAL PLANARIZATION POLISHING HEAD Public/Granted day:2016-03-03
Information query
IPC分类:
