公开(公告)号：US20230356355A1

公开(公告)日：2023-11-09

申请号：US17735674

申请日：2022-05-03

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon Oh ,  Brian J. Brown ,  Huanbo Zhang ,  Andrew Nagengast ,  Steven M. Zuniga ,  Ekaterina A. Mikhaylichenko ,  Eric L. Lau ,  Jay Gurusamy ,  David J. Lischka

IPC: B24B37/32 ,  B24B37/04

CPC classification number: B24B37/32 ,  B24B37/042

Abstract: Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a substrate mounting surface coupled with the carrier body. The carrier heads may include an inner ring that is sized and shaped to circumferentially surround a peripheral edge of a substrate positioned against the substrate mounting surface. The inner ring may be characterized by a first surface that faces the carrier body and a second surface opposite the first surface. The carrier heads may include at least one downforce control actuator disposed above the first surface of the inner ring at a discrete position about a circumference of the inner ring.

公开(公告)号：US12214469B2

公开(公告)日：2025-02-04

申请号：US17501687

申请日：2021-10-14

Applicant: Applied Materials, Inc.

Inventor： Andrew Nagengast ,  Steven M. Zuniga ,  Jay Gurusamy

IPC: B24B37/32 ,  B24B37/005 ,  B24B49/16 ,  H01L21/306

Abstract: Embodiments herein generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of electronic devices. In one embodiment, a substrate carrier for polishing a surface of a substrate includes a retaining ring configured to surround a substrate during a polishing process. The retaining ring includes a first surface that is configured to contact a surface of a polishing pad during the polishing process, a second surface that is on a side of the retaining ring that is opposite to the first surface, and an array of recesses formed in the second surface. The substrate carrier for polishing a surface of a substrate also includes a plurality of load bearing pins where each load bearing pin of the plurality of load bearing pins includes a contact surface and a body that has a length, and at least a portion of the length of each load bearing pin of the plurality of load bearing pins is disposed within each recess of the array of recesses and the contact surface of each load bearing pin of the plurality of load bearing pins is positionable relative to a surface of the recess in which it is disposed during the polishing process.

公开(公告)号：US11986923B2

公开(公告)日：2024-05-21

申请号：US17512284

申请日：2021-10-27

Applicant: Applied Materials, Inc.

Inventor： Andrew Nagengast ,  Steven M. Zuniga ,  Jay Gurusamy ,  Charles C. Garretson ,  Vladimir Galburt

IPC: B24B37/32 ,  B24B37/005 ,  B24B37/04

CPC classification number: B24B37/32 ,  B24B37/005 ,  B24B37/04

Abstract: A polishing system includes a carriage arm having an actuator disposed on a lower surface thereof. The actuator includes a piston and a roller coupled to a distal end of the piston. The polishing system includes a polishing pad and a substrate carrier suspended from the carriage arm and configured to apply a pressure between a substrate and the polishing pad. The substrate carrier includes a housing, a retaining ring, and a membrane. The substrate carrier includes an upper load ring disposed in the housing. The roller of the actuator is configured to contact the upper load ring during relative rotation between the substrate carrier and the carriage arm. The actuator is configured to apply a load to a portion of the upper load ring thereby altering the pressure applied between the substrate and the polishing pad.

公开(公告)号：US20250108477A1

公开(公告)日：2025-04-03

申请号：US18477159

申请日：2023-09-28

Applicant: Applied Materials, Inc.

Inventor： Huanbo Zhang ,  Ekaterina A. Mikhaylichenko ,  Jeonghoon Oh ,  Andrew Nagengast ,  Erik S. Rondum ,  Brian J. Brown ,  Zhize Zhu

IPC: B24B37/10 ,  B24B37/26 ,  B24B57/02

Abstract: A Chemical Mechanical Polishing (CMP) process may generally apply more pressure around a periphery of the polishing pad than at the center of the polishing pad. This may cause uneven material removal as the substrate moves along the surface of the polishing pad. Therefore, the polishing pad may include one or more recesses around a periphery of the polishing pad to relieve pressure on the substrate. The one or more recesses may be connected to channels that extend radially outward from the recesses to the edge of the polishing pad. The recesses may collect polishing slurry during the CMP process and direct the slurry into the channels. The channels may then expel the collected polishing slurry off of the polishing pad to clear the recesses.

公开(公告)号：US12251788B2

公开(公告)日：2025-03-18

申请号：US18630886

申请日：2024-04-09

Applicant: Applied Materials, Inc.

Inventor： Andrew Nagengast ,  Steven M. Zuniga ,  Jay Gurusamy ,  Charles C. Garretson ,  Vladimir Galburt

IPC: B24B37/32 ,  B24B37/005 ,  B24B37/04

Abstract: A polishing system includes a carriage arm having an actuator disposed on a lower surface thereof. The actuator includes a piston and a roller coupled to a distal end of the piston. The polishing system includes a polishing pad and a substrate carrier suspended from the carriage arm and configured to apply a pressure between a substrate and the polishing pad. The substrate carrier includes a housing, a retaining ring, and a membrane. The substrate carrier includes an upper load ring disposed in the housing. The roller of the actuator is configured to contact the upper load ring during relative rotation between the substrate carrier and the carriage arm. The actuator is configured to apply a load to a portion of the upper load ring thereby altering the pressure applied between the substrate and the polishing pad.

公开(公告)号：US11660721B2

公开(公告)日：2023-05-30

申请号：US17178746

申请日：2021-02-18

Applicant: Applied Materials, Inc.

Inventor： Steven M. Zuniga ,  Andrew Nagengast

IPC: B24B37/32 ,  B24B37/04

CPC classification number: B24B37/32 ,  B24B37/042

Abstract: A substrate carrier configured to be attached to a polishing system for polishing a substrate is described herein. The substrate carrier includes a housing including a plurality of load couplings and a retaining ring coupled to the housing. The retaining ring can include an annular body having a central axis, an inner edge facing the central axis of the annular body, the inner edge having a diameter configured to surround a substrate, and an outer edge opposite the inner edge, wherein the plurality of load couplings contact the retaining ring at different radial distances measured from the central axis, and wherein the plurality of load couplings are configured to apply a radially differential force to the retaining ring.

公开(公告)号：US11904429B2

公开(公告)日：2024-02-20

申请号：US17495679

申请日：2021-10-06

Applicant: Applied Materials, Inc.

Inventor： Steven M. Zuniga ,  Andrew Nagengast ,  Jay Gurusamy

IPC: B24B37/005 ,  B24B37/12 ,  B24B37/20 ,  B24B37/02

CPC classification number: B24B37/005 ,  B24B37/02 ,  B24B37/12 ,  B24B37/20

Abstract: An apparatus for chemical mechanical polishing (CMP) of a substrate is described herein. The apparatus includes an extension disposed between a retaining ring and a chucking membrane. The extension is disposed radially outward from the edge of the substrate and is configured to contact the retaining ring during substrate processing. The extension provides a repeatable and controlled point of contact between the retaining ring and the chucking membrane. The extension may have multiple configurations, such that the contact point between the retaining ring and the chucking membrane is set at a pre-determined location or such that the contact point is moveable by an adjustable stop.

公开(公告)号：US20230356354A1

公开(公告)日：2023-11-09

申请号：US17735655

申请日：2022-05-03

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon Oh ,  Andrew Nagengast ,  Steven M. Zuniga ,  Eric L. Lau ,  Hari Prasath Rajendran ,  Satish Radhakrishnan ,  Kuen-Hsiang Chen ,  Ekaterina A. Mikhaylichenko

IPC: B24B37/32 ,  B24B37/04

CPC classification number: B24B37/32 ,  B24B37/042

Abstract: Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a substrate mounting surface coupled with the carrier body. The carrier heads may include an inner ring that is sized and shaped to circumferentially surround a peripheral edge of a substrate positioned against the substrate mounting surface. The inner ring may be characterized by a first end having a first surface that faces the carrier body and a second end having a second surface opposite the first surface. The second end of the inner ring may be radially displaceable. The carrier heads may include an outer ring having an inner surface that is disposed against an outer surface of the inner ring.

公开(公告)号：US11623321B2

公开(公告)日：2023-04-11

申请号：US17087941

申请日：2020-11-03

Applicant: Applied Materials, Inc.

Inventor： Andrew Nagengast ,  Steven M. Zuniga ,  Jay Gurusamy

IPC: B24B37/32 ,  B24B49/16 ,  B24B37/005 ,  H01L21/306

Abstract: Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of semiconductor devices. In one embodiment, the apparatus includes a polishing module, a retaining ring, wherein the retaining ring includes a protrusion on a radially outward edge, and a plurality of load pins disposed through the retaining ring.

公开(公告)号：US20220258301A1

公开(公告)日：2022-08-18

申请号：US17178746

申请日：2021-02-18

Applicant: Applied Materials, Inc.

Inventor： Steven M. Zuniga ,  Andrew Nagengast

IPC: B24B37/32 ,  B24B37/04

Abstract: A substrate carrier configured to be attached to a polishing system for polishing a substrate is described herein. The substrate carrier includes a housing including a plurality of load couplings and a retaining ring coupled to the housing. The retaining ring can include an annular body having a central axis, an inner edge facing the central axis of the annular body, the inner edge having a diameter configured to surround a substrate, and an outer edge opposite the inner edge, wherein the plurality of load couplings contact the retaining ring at different radial distances measured from the central axis, and wherein the plurality of load couplings are configured to apply a radially differential force to the retaining ring.