Invention Grant
- Patent Title: Microelectromechanical systems devices with improved lateral sensitivity
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Application No.: US14318199Application Date: 2014-06-27
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Publication No.: US09612254B2Publication Date: 2017-04-04
- Inventor: Michael Naumann
- Applicant: Freescale Semiconductor, Inc.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: G01P15/125
- IPC: G01P15/125 ; B81B7/00 ; B81C1/00 ; G01P15/08

Abstract:
Microelectromechanical system (MEMS) devices and methods for forming MEMS devices are provided. The MEMS devices include a substrate, an anchored structure fixedly coupled to the substrate, and a movable structure resiliently coupled to the substrate. The movable structure has an opening formed therethrough and is positioned such that the anchored structure is at least partially within the opening and is in a capacitor-forming relationship with the movable structure. The movable structure comprises a movable structure finger extending only partially across the opening.
Public/Granted literature
- US20150375989A1 MICROELECTROMECHANICAL SYSTEMS DEVICES WITH IMPROVED LATERAL SENSITIVITY Public/Granted day:2015-12-31
Information query
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