Invention Grant
- Patent Title: Mask blank, transfer mask, method of manufacturing a transfer mask, and method of manufacturing a semiconductor device
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Application No.: US14690875Application Date: 2015-04-20
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Publication No.: US09612527B2Publication Date: 2017-04-04
- Inventor: Atsushi Kominato , Masahiro Hashimoto , Osamu Nozawa
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-221661 20100930
- Main IPC: G03F1/26
- IPC: G03F1/26 ; G03F1/32 ; G03F1/50 ; G03F1/58 ; H01L21/266 ; H01L21/268 ; G03F1/00 ; G03F7/20 ; H01L21/311

Abstract:
A mask blank for use in the manufacture of a binary mask adapted to be applied with ArF excimer laser exposure light has, on a transparent substrate, a light-shielding film for forming a transfer pattern. The light-shielding film has a laminated structure of a lower layer and an upper layer and has an optical density of 2.8 or more for exposure light and a thickness of 45 nm or less. The lower layer is made of a material in which the total content of a transition metal and silicon is 90 at % or more, and has a thickness of 30 nm or more. The upper layer has a thickness of 3 nm or more and 6 nm or less. The phase difference between exposure light transmitted through the light-shielding film and exposure light transmitted in air for a distance equal to the thickness of the light-shielding film is 30 degrees or less.
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