Invention Grant
- Patent Title: Semiconductor memory device
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Application No.: US14462584Application Date: 2014-08-19
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Publication No.: US09613703B2Publication Date: 2017-04-04
- Inventor: Makoto Senoo
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: Jianq Chyun IP Office
- Priority: JP2013-221698 20131025
- Main IPC: G11C11/00
- IPC: G11C11/00 ; G11C16/10 ; G11C16/04 ; G11C16/06 ; G11C7/10

Abstract:
A semiconductor memory device for high speed operation, and for flexible data reading and programming is disclosed. The flash memory of the present disclosure includes: a page buffer/sensor circuit including a volatile memory element that may maintain data with a size corresponding to a page of a memory array; a high speed cache register including a non-volatile memory element that may maintain data with a size corresponding to a page of a memory array. The page buffer/sensor circuit includes a sensor circuit, a data register, and a transmission gate. The data register may transmit and receive data with an input-output buffer. The high speed cache register includes RRAM, wherein the RRAM may transmit and receive data with an input-output buffer via a transmission gate, and may transmit and receive data with the data register via a transmission gate.
Public/Granted literature
- US20150117104A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2015-04-30
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