Invention Grant
- Patent Title: Processes for fabricating MEMS switches and other miniaturized devices having encapsulating enclosures
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Application No.: US14696623Application Date: 2015-04-27
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Publication No.: US09613770B2Publication Date: 2017-04-04
- Inventor: John E. Rogers , Michael R. Weatherspoon
- Applicant: HARRIS CORPORATION
- Applicant Address: US FL Melbourne
- Assignee: Harris Corporation
- Current Assignee: Harris Corporation
- Current Assignee Address: US FL Melbourne
- Agency: Fox Rothschild LLP
- Agent Robert J. Sacco; Carol E Thorstad-Forsyth
- Main IPC: B05D5/12
- IPC: B05D5/12 ; H01H49/00 ; H01H1/00 ; H01H59/00 ; B05D1/32 ; B81C1/00 ; B05D7/00
Abstract:
Miniaturized devices such as MEMS switches (10) have encapsulating enclosures (100). The enclosure (100) and the remainder of the switch (10) are fabricated on a concurrent basis by depositing layers of an electrically-conductive material, such as copper, on a substrate (26).
Public/Granted literature
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