Invention Grant
- Patent Title: Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
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Application No.: US14325601Application Date: 2014-07-08
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Publication No.: US09613858B2Publication Date: 2017-04-04
- Inventor: Vincent Paneccasio, Jr. , Xuan Lin , Richard Hurtubise , Qingyun Chen
- Applicant: Enthone Inc.
- Agency: Carmody Torrance Sandak & Hennessey LLP
- Main IPC: C25D5/02
- IPC: C25D5/02 ; C25D3/38 ; H05K3/42 ; H01L21/768 ; C25D7/12 ; H01L21/288 ; H01L23/532
Abstract:
A method and composition for metallizing a via feature in a semiconductor integrated circuit device substrate, using a leveler compound which is a dipyridyl compound.
Public/Granted literature
- US20140322912A1 METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS Public/Granted day:2014-10-30
Information query
