Invention Grant
- Patent Title: Methods of fabricating tape film packages
-
Application No.: US14967490Application Date: 2015-12-14
-
Publication No.: US09620389B2Publication Date: 2017-04-11
- Inventor: Jeong-Kyu Ha , Youngshin Kwon , KwanJai Lee , Jae-Min Jung , KyongSoon Cho , Sang-Uk Han
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Ward and Smith, P.A.
- Priority: KR10-2012-0007303 20120125
- Main IPC: H01L23/14
- IPC: H01L23/14 ; H01L23/498 ; H01L21/48 ; H05K1/11 ; H05K3/10 ; H01L23/00 ; H01L23/495 ; H05K3/00 ; H01L21/56 ; H01L21/78 ; H05K1/18 ; H05K3/42
Abstract:
A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns extending from the via contact to a cutting surface of the insulating pattern; and second interconnection patterns connected to the via contact below the insulating pattern. The second interconnection patterns are parallel to the first interconnection patterns and spaced apart from the cutting surface of the insulating pattern.
Public/Granted literature
- US20160111299A1 Methods of Fabricating Tape Film Packages Public/Granted day:2016-04-21
Information query
IPC分类:
