Invention Grant
- Patent Title: Power semiconductor package with conductive clips
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Application No.: US14723378Application Date: 2015-05-27
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Publication No.: US09620471B2Publication Date: 2017-04-11
- Inventor: Martin Standing , Robert J. Clarke
- Applicant: Infineon Technologies Americas Corp.
- Applicant Address: US CA El Segundo
- Assignee: Infineon Technologies Americas Corp.
- Current Assignee: Infineon Technologies Americas Corp.
- Current Assignee Address: US CA El Segundo
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/498 ; H01L23/00 ; H01L23/31 ; H01L23/482 ; H01L23/29 ; H01L29/20 ; H01L29/201 ; H01L29/417 ; H01L29/423
Abstract:
A power semiconductor package that includes a semiconductor die having at least two power electrodes and a conductive clip electrically and mechanically coupled to each power electrode.
Public/Granted literature
- US20150262960A1 Power Semiconductor Package with Conductive Clips Public/Granted day:2015-09-17
Information query
IPC分类:
