Invention Grant
- Patent Title: Solid-state image pickup device, method of manufacturing solid-state image pickup device, and electronic apparatus
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Application No.: US14889552Application Date: 2014-05-09
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Publication No.: US09620539B2Publication Date: 2017-04-11
- Inventor: Ryosuke Nakamura , Fumihiko Koga , Taiichiro Watanabe
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2013-104000 20130516
- International Application: PCT/JP2014/002458 WO 20140509
- International Announcement: WO2014/185039 WO 20141120
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L27/146 ; G01J1/44
Abstract:
There is provided a solid-state image pickup device including: a semiconductor substrate (21); a photodiode (11A, 11B) formed in the semiconductor substrate; a transistor (10) having a gate electrode (14) part or all of which is embedded in the semiconductor substrate, the transistor being configured to read a signal electric charge from the photodiode via the gate electrode; and an electric charge transfer layer (13) provided between the gate electrode and the photodiode.
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