Invention Grant
- Patent Title: Semiconductor memory device, method for repairing bad column and setting method for setting redundant information thereof
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Application No.: US15202578Application Date: 2016-07-06
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Publication No.: US09627094B2Publication Date: 2017-04-18
- Inventor: Masaru Yano
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: Jianq Chyun IP Office
- Priority: JP2015-136735 20150708
- Main IPC: G11C11/34
- IPC: G11C11/34 ; G11C29/00 ; G11C16/34 ; G11C16/08

Abstract:
A method for repairing of the invention includes steps as follows: storing redundant information including an address of the bad column, identification information for identifying a failure in which one of an even column or an odd column of the bad column and an address of a redundant column of a redundant memory region for repairing the bad column; determining whether a column address of a selected column is consistent with the address of the bad column based on the redundant information; when consistent, converting a column of the bad column having the failure into a column of the redundant column based on the identification information; and not converting another column of the bad column without the failure into another column of the redundant column.
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