Invention Grant
- Patent Title: Solder spacer and electronic module comprising such a spacer
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Application No.: US14405094Application Date: 2013-05-23
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Publication No.: US09629245B2Publication Date: 2017-04-18
- Inventor: Stephane Kohn
- Applicant: SAGEMCOM BROADBAND SAS
- Applicant Address: FR Rueil Malmaison
- Assignee: Sagemcom Broadband SAS
- Current Assignee: Sagemcom Broadband SAS
- Current Assignee Address: FR Rueil Malmaison
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: FR1256100 20120627
- International Application: PCT/EP2013/060676 WO 20130523
- International Announcement: WO2014/000999 WO 20140103
- Main IPC: F16B37/06
- IPC: F16B37/06 ; H05K1/14 ; H05K3/34 ; H05K3/36 ; H05K1/11
Abstract:
The invention provides a spacer for soldering comprising an elongate body having one end provided with a tapped hole and an opposite end provided with a transverse bearing surface having a smooth centering peg projecting therefrom, the peg has a longitudinal outer passage extending over at least a fraction of its length as far as the transverse bearing surface to enable molten solder to penetrate by capillarity as far as the transverse bearing surface. The invention also provides a module including such a spacer.
Public/Granted literature
- US20150173192A1 SOLDER SPACER AND ELECTRONIC MODULE COMPRISING SUCH A SPACER Public/Granted day:2015-06-18
Information query
