Invention Grant
- Patent Title: Gyro MEMS sensor package
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Application No.: US15133309Application Date: 2016-04-20
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Publication No.: US09637376B2Publication Date: 2017-05-02
- Inventor: Kelvin Po Leung Pun , Chee Wah Cheung
- Applicant: Compass Technology Company Limited
- Applicant Address: HK Shatin
- Assignee: Compass Technology Company Limited
- Current Assignee: Compass Technology Company Limited
- Current Assignee Address: HK Shatin
- Agency: Saile Ackerman LLC
- Agent Stephen B. Ackerman; Rosemary L.S. Pike
- Main IPC: H01L23/02
- IPC: H01L23/02 ; B81B7/00 ; G01C19/00 ; G01C19/5783 ; B81C1/00
Abstract:
An integrated circuit packaging structure comprises at least one Micro Electrical Mechanical Systems (MEMS) gyroscope die mounted directly on a multi-layer flexible substrate having at least one metal layer and wire-bonded to the flexible substrate and a lid or die coating protecting the MEMS die and wire bonds.
Public/Granted literature
- US20160229686A1 Gyro MEMS Sensor Package Public/Granted day:2016-08-11
Information query
IPC分类:
