Invention Grant
- Patent Title: Method for manufacturing printed circuit boards
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Application No.: US13947525Application Date: 2013-07-22
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Publication No.: US09648720B2Publication Date: 2017-05-09
- Inventor: Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
- Applicant: Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
- Applicant Address: GB London
- Assignee: Semblant Global Limited
- Current Assignee: Semblant Global Limited
- Current Assignee Address: GB London
- Agency: Baker Botts L.L.P.
- Priority: GB0800552 20080218
- Main IPC: H05K3/28
- IPC: H05K3/28 ; H05K1/02 ; H05K3/00 ; H01L23/00
Abstract:
A method including: attaching a plurality of conductive tracks to at least one surface of a substrate, depositing a coating comprising at least one halo-hydrocarbon polymer on the at least one surface of the substrate, and soldering through the coating.
Public/Granted literature
- US20130334292A1 Printed Circuit Boards Public/Granted day:2013-12-19
Information query
