A flexible circuit board includes an electrically insulating top sheet and an electrically insulating bottom sheet. A plurality of conductive traces is positioned between the electrically insulating top and bottom sheets. A first conductive trace has a first contact pad, and a second conductive trace has a second contact pad. The first and second contact pads are exposed through at least one opening in the electrically insulating top sheet, and each of the first and second contact pads are configured to be connected to an LED. A third contact pad is exposed through openings in the electrically insulating top and bottom sheets, with a top surface of the third contact pad configured to be connected to the LED and a bottom surface of the third contact pad configured to be connected to a heat diffusion device.