Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15073219Application Date: 2016-03-17
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Publication No.: US09653336B2Publication Date: 2017-05-16
- Inventor: Yi Seul Han , Jae Beum Shim , Byong Jin Kim , In Bae Park
- Applicant: Amkor Technology, Inc.
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2015-0037381 20150318
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/683 ; H01L21/768 ; H01L23/00 ; H01L21/288 ; H01L23/31
Abstract:
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of making electronic devices, and electronic devices made thereby, that utilize a film assist mold process.
Public/Granted literature
- US20160276178A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-09-22
Information query
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