A heat dissipation package structure includes a substrate, a chip disposed on the substrate and a heat dissipation sheet. The heat dissipation sheet comprises a covering portion disposed on a back surface of the chip, a first lateral covering portion disposed on a first lateral surface of the chip and a first conducting portion disposed on the substrate. The back surface comprises a first width, the covering portion comprises a second width, the chip comprises a thickness, and there is an interval between the chip and the substrate. The second width is not larger than summation of the first width, double the interval and double the thickness for making the chip disposed between the heat dissipation sheet and the substrate is not within a completely sealed space so as to prevent the heat dissipation sheet from deformation and separation from the chip or the substrate cause of air expansion.