Invention Grant
- Patent Title: LED module with LED chips
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Application No.: US14899163Application Date: 2014-06-12
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Publication No.: US09653436B2Publication Date: 2017-05-16
- Inventor: Reiner Windisch , Krister Bergenek , Andreas Biebersdorf , Ralph Wirth
- Applicant: OSRAM GmbH
- Applicant Address: DE Munich
- Assignee: OSRAM GMBH
- Current Assignee: OSRAM GMBH
- Current Assignee Address: DE Munich
- Agency: Viering, Jentschura & Partner mbB
- Priority: DE102013211525 20130619
- International Application: PCT/EP2014/062257 WO 20140612
- International Announcement: WO2014/202461 WO 20141224
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L33/50 ; F21Y115/10 ; F21Y113/13 ; F21Y113/17

Abstract:
Various embodiments may relate to an LED module, including a number of first inherently unpackaged LED chips, which are in each case designed to emit light of a first color at a respective light emission area, and a number of second inherently unpackaged LED chips, which are in each case designed to emit light of a second color, different than the first color, at a respective light emission area. The LED chips are provided jointly in a housing, and the respective light emission area of a second LED chip is at least 25% smaller than the respective light emission area of a first LED chip. The sum of the light emission areas of the first LED chips is at least 50% greater than the sum of the light emission areas of the second LED chips.
Public/Granted literature
- US20160133612A1 LED MODULE WITH LED CHIPS Public/Granted day:2016-05-12
Information query
IPC分类: