- Patent Title: Compound semiconductor device and method of manufacturing the same
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Application No.: US14747060Application Date: 2015-06-23
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Publication No.: US09653590B2Publication Date: 2017-05-16
- Inventor: Junji Kotani
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2014-129563 20140624
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/201 ; H01L29/66 ; H01L29/10 ; H01L29/20 ; H01L29/205 ; H01L21/02 ; H01L29/167

Abstract:
A compound semiconductor device includes: a semiconductor substrate; a channel layer over the semiconductor substrate; a carrier supply layer over the channel layer; and a gate electrode, a source electrode and a drain electrode above the carrier supply layer. The semiconductor substrate includes an impurity-containing region containing an impurity, the impurity forms a level lower than a lower edge of a conduction band of silicon by 0.25 eV or more, the impurity forms the level higher than an upper edge of a valence band of silicon.
Public/Granted literature
- US20150372125A1 COMPOUND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-12-24
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