Invention Grant
- Patent Title: Fabrication process for mitigating external resistance of a multigate device
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Application No.: US14982687Application Date: 2015-12-29
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Publication No.: US09653606B2Publication Date: 2017-05-16
- Inventor: Anirban Basu , Guy Cohen , Amlan Majumdar
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Louis Percello
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/205 ; H01L29/66 ; H01L29/201 ; H01L29/778

Abstract:
A method for fabricating a multigate device includes forming a fin on a substrate of the multigate device, the fin being formed of a semiconductor material, growing a first conformal epitaxial layer directly on the fin and substrate, wherein the first conformal epitaxial layer is highly doped, growing a second conformal epitaxial layer directly on the first conformal epitaxial layer, wherein the second conformal epitaxial layer is highly doped, selectively removing a portion of second epitaxial layer to expose a portion of the first conformal epitaxial layer, selectively removing a portion of the first conformal epitaxial layer to expose a portion of the fin and thereby form a trench, and forming a gate within the trench.
Public/Granted literature
- US20160133750A1 FABRICATION PROCESS FOR MITIGATING EXTERNAL RESISTANCE OF A MULTIGATE DEVICE Public/Granted day:2016-05-12
Information query
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