Invention Grant
- Patent Title: Apparatuses, systems, and methods for die attach coatings for semiconductor packages
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Application No.: US14603261Application Date: 2015-01-22
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Publication No.: US09659898B1Publication Date: 2017-05-23
- Inventor: Tarak A. Railkar , Kevin J. Anderson , Walid Meliane , John M. Beall
- Applicant: TriQuint Semiconductor, Inc.
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L23/00 ; H01L23/29 ; H01L21/56
Abstract:
Embodiments of the present disclosure are directed towards apparatuses, systems, and methods for die attach coatings for semiconductor packages. In one embodiment, a die may be coupled with a substrate by a die attach and a coating may be applied to an edge of the die attach.
Information query
IPC分类:
