Invention Grant
- Patent Title: Image sensor isolation region and method of forming the same
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Application No.: US13415546Application Date: 2012-03-08
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Publication No.: US09673244B2Publication Date: 2017-06-06
- Inventor: Shiu-Ko JangJian , Min Hao Hong , Kei-Wei Chen , Szu-An Wu
- Applicant: Shiu-Ko JangJian , Min Hao Hong , Kei-Wei Chen , Szu-An Wu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L31/109
- IPC: H01L31/109 ; H01L27/146

Abstract:
Image sensors comprising an isolation region according to embodiments are disclosed, as well as methods of forming the image sensors with isolation region. An embodiment is a structure comprising a semiconductor substrate, a photo element in the semiconductor substrate, and an isolation region in the semiconductor substrate. The isolation region is proximate the photo element and comprises a dielectric material and an epitaxial region. The epitaxial region is disposed between the semiconductor substrate and the dielectric material.
Public/Granted literature
- US20130234202A1 Image Sensor Isolation Region and Method of Forming the Same Public/Granted day:2013-09-12
Information query
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