Invention Grant
- Patent Title: Substrate treatment apparatus and substrate treatment method
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Application No.: US14670983Application Date: 2015-03-27
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Publication No.: US09694371B2Publication Date: 2017-07-04
- Inventor: Takashi Ootagaki , Konosuke Hayashi
- Applicant: SHIBAURA MECHATRONICS CORPORATION
- Applicant Address: JP Yokohama-shi
- Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee Address: JP Yokohama-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2014-072791 20140331
- Main IPC: B05C5/02
- IPC: B05C5/02 ; B05B1/26 ; B05B3/10 ; H01L21/67 ; B05B3/04 ; B05C13/02 ; B05B13/02

Abstract:
A substrate treatment apparatus according to the embodiment includes: a nozzle which ejects a treatment liquid onto a treatment target surface of a substrate; a trajectory deflector including a trajectory deflecting surface, which is an annular inclined surface that deflects a traveling direction of the treatment liquid ejected from the nozzle and makes the treatment liquid incident on the treatment target surface, the trajectory deflecting surface having an inclination angle varying in a direction of annular extension of the trajectory deflecting surface; and a position changer which moves an incident position of the treatment liquid on the trajectory deflecting surface in the direction of annular extension of the trajectory deflecting surface.
Public/Granted literature
- US20150273491A1 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD Public/Granted day:2015-10-01
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