Invention Grant
- Patent Title: Semiconductor device having semiconductor chip mounted on lead frame
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Application No.: US14644249Application Date: 2015-03-11
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Publication No.: US09698064B2Publication Date: 2017-07-04
- Inventor: Yasuhiro Taguchi
- Applicant: SEIKO INSTRUMENTS INC.
- Applicant Address: JP
- Assignee: SII Semiconductor Corporation
- Current Assignee: SII Semiconductor Corporation
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2014-056450 20140319
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/495 ; H01L21/66 ; H01L21/48 ; H01L23/31
Abstract:
A semiconductor device uses a lead frame, in which an outer lead is electrically connected to an inner lead suspension lead via an inner lead. An encapsulating resin covers the inner lead and part of the outer lead, and a plated film is formed on an outer lead cut surface so that a solder layer is easily formed on all surfaces of the outer lead extending from the encapsulating resin. The inner lead suspension lead includes a narrowed portion that is smaller in cross-sectional area than other portions of the inner lead suspension lead to suppress impact forces generated when the inner lead suspension lead is cut.
Public/Granted literature
- US20150270197A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-09-24
Information query
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