Invention Grant
- Patent Title: Metal deposition on substrates
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Application No.: US15073551Application Date: 2016-03-17
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Publication No.: US09698106B2Publication Date: 2017-07-04
- Inventor: Kae-Horng Wang , Francisco Javier Santos Rodriguez , Michael Knabl , Guenther Koffler
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L23/00 ; H01L21/02 ; C23C16/34 ; C23C16/40 ; C23C16/50 ; C23C18/16 ; G03F7/16 ; G03F7/20 ; G03F7/26 ; H01J37/32 ; H01L21/311 ; H01L21/288 ; H01L23/485 ; H01L27/146
Abstract:
Various techniques, methods, devices and apparatus are provided where an isolation layer is provided at a peripheral region of the substrate, and one or more metal layers are deposited onto the substrate.
Public/Granted literature
- US20160203979A1 Metal Deposition on Substrates Public/Granted day:2016-07-14
Information query
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