An electronic package that includes a substrate and a die attached to the substrate. A plurality of supports attached to the substrate adjacent to the die. At least one support in the plurality of supports is positioned adjacent to at least one corner of the die such that the at least one corner of the die is positioned adjacent to the at least one support. Other example forms relate to a method of fabricating an electronic package. The method includes securing a die to a substrate and securing a plurality of supports to the substrate such that at least one support is adjacent to at least one corner of the die.