公开(公告)号：US20240355759A1

公开(公告)日：2024-10-24

申请号：US18136775

申请日：2023-04-19

Applicant: Intel Corporation

Inventor： Phil Geng ,  Baris Bicen ,  Kai Xiao ,  Sanjoy Saha ,  Prasanna Raghavan

IPC: H01L23/00

CPC classification number: H01L23/562 ,  H01L23/3675 ,  H01L23/4006 ,  H01L2023/4081 ,  H01L2023/4087 ,  H01L23/427 ,  H01L24/32 ,  H01L24/71 ,  H01L2224/32245 ,  H01L2224/71

Abstract: Damping structures in integrated circuit (IC) devices, and techniques for forming the structures are discussed. An IC device includes, between an IC package and a socket, both a spring force and a damping structure adjacent an array of pins and corresponding lands. The damping structure may be of a dissipative, viscous, or viscoelastic material. The damping structure may be between the IC package and socket. The damping structure may be within a periphery of the socket. The damping structure may be coupled to the IC package or the socket by an adhesive or a press fit. A heatsink or a heat spreader may be coupled to the IC package over the socket.

公开(公告)号：US20250102744A1

公开(公告)日：2025-03-27

申请号：US18476089

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Kumar Abhishek Singh ,  Peter A. Williams ,  Ziyin Lin ,  Fan Fan ,  Yang Wu ,  Saikumar Jayaraman ,  Baris Bicen ,  Darren Vance ,  Anurag Tripathi ,  Divya Pratap ,  Stephanie J. Arouh

IPC: G02B6/42

Abstract: Technologies for fiber array unit (FAU) lid designs are disclosed. In one embodiment, channels in the lid allow for suction to be applied to fibers that the lid covers, pulling the fibers into place in a V-groove. The suction can hold the fibers in place as the fiber array unit is mated with a photonic integrated circuit (PIC) die. Additionally or alternatively, channels can be on pitch, allowing for pulling the FAU towards a PIC die as well as sensing the position and alignment of the FAU to the PIC die. In another embodiment, a warpage amount of a PIC die is characterized, and a FAU lid with a similar warpage is fabricated, allowing for the FAU to position fibers correctly relative to waveguides in the PIC die. In another embodiment, a FAU has an extended lid, which can provide fiber protection as well as position and parallelism tolerance control.

公开(公告)号：US10969574B2

公开(公告)日：2021-04-06

申请号：US16072157

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Feras Eid ,  Johanna M. Swan ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Thomas L. Sounart ,  Baris Bicen ,  Valluri R. Rao

IPC: G02B26/00 ,  G02B26/08 ,  H01L41/047 ,  H01L41/27 ,  H01L41/314 ,  H01L41/332

Abstract: Embodiments of the invention include a piezo-electric mirror in an microelectronic package and methods of forming the package. According to an embodiment the microelectronic package may include an organic substrate with a cavity formed in the organic substrate. In some embodiments, an actuator is anchored to the organic substrate and extends over the cavity. For example, the actuator may include a first electrode and a piezo-electric layer formed on the first electrode. A second electrode may be formed on the piezo-electric layer. Additionally, a mirror may be formed on the actuator. Embodiments allow for the piezo-electric layer to be formed on an organic package substrate by using low temperature crystallization processes. For example, the piezo-electric layer may be deposited in an amorphous state. Thereafter, a laser annealing process that includes a pulsed laser may be used to crystallize the piezo-electric layer.

公开(公告)号：US10594294B2

公开(公告)日：2020-03-17

申请号：US15088830

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Feras Eid ,  Baris Bicen ,  Telesphor Kamgaing ,  Vijay K. Nair ,  Georgios C. Dogiamis ,  Johanna M. Swan ,  Valluri R. Rao

IPC: H03H9/13 ,  H03H9/36

Abstract: Embodiments of the invention include a waveguide structure that includes a first piezoelectric transducer that is positioned in proximity to a first end of a cavity of an organic substrate. The first piezoelectric transducer receives an input electrical signal and generates an acoustic wave to be transmitted with a transmission medium. A second piezoelectric transducer is positioned in proximity to a second end of the cavity. The second piezoelectric transducer receives the acoustic wave from the transmission medium and generates an output electrical signal.

公开(公告)号：US11016288B2

公开(公告)日：2021-05-25

申请号：US16072161

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Feras Eid ,  Johanna M. Swan ,  Thomas L. Sounart ,  Aleksandar Aleksov ,  Shawna M. Liff ,  Baris Bicen ,  Valluri R. Rao

IPC: G02B26/08 ,  H01L27/20 ,  H01L41/09 ,  H01L41/253

Abstract: Embodiments of the invention include a display formed on an organic substrate and methods of forming such a device. According to an embodiment, an array of pixel mirrors may be formed on the organic substrate. For example, each of the pixel mirrors is actuatable about one or more axes out of the plane of the organic substrate. Additionally, embodiments of the invention may include an array of routing mirrors formed on the organic substrate. According to an embodiment, each of the routing mirrors is actuatable about two axes out of the plane of the organic substrate. In embodiments of the invention, a light source may be used for emitting light towards the array of routing mirrors. For example, light emitted from the light source may be reflected to one or more of the pixel mirrors by one of the routing mirrors.

公开(公告)号：US10649158B2

公开(公告)日：2020-05-12

申请号：US16098406

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Johanna M. Swan ,  Aleksandar Aleksov ,  Sasha N. Oster ,  Feras Eid ,  Baris Bicen ,  Thomas L. Sounart ,  Shawna M. Liff ,  Valluri R. Rao

IPC: G02B6/42 ,  G02B6/36

Abstract: Embodiments of the invention include an optoelectronic package that allows for in situ alignment of optical fibers. In an embodiment, the optoelectronic package may include an organic substrate. Embodiments include a cavity formed into the organic substrate. Additionally, the optoelectronic package may include an actuator formed on the organic substrate that extends over the cavity. In one embodiment, the actuator may include a first electrode, a piezoelectric layer formed on the first electrode, and a second electrode formed on the piezoelectric layer. According to an additional embodiment of the invention, the actuator may include a first portion and a second portion. In order to allow for resistive heating and actuation driven by thermal expansion, a cross-sectional area of the first portion of the beam may be greater than a cross-sectional area of the second portion of the beam.

公开(公告)号：US20190006259A1

公开(公告)日：2019-01-03

申请号：US15637107

申请日：2017-06-29

Applicant: Intel Corporation

Inventor： Dinesh Padmanabhan Ramalekshmi Thanu ,  Wei Hu ,  James C. Matayabas, JR. ,  Baris Bicen ,  Luke J. Garner ,  Hemanth Dhavaleswarapu

IPC: H01L23/367 ,  H01L25/065 ,  H01L23/00

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a first die disposed on a substrate and a second die disposed adjacent the first die on the substrate. A cooling solution is attached to the substrate, wherein a rib extends from a central region of the cooling solution and is attached to the substrate. The rib is disposed between the first die and the second die.

公开(公告)号：US11646274B2

公开(公告)日：2023-05-09

申请号：US16444615

申请日：2019-06-18

Applicant: Intel Corporation

Inventor： Mufei Yu ,  Gang Duan ,  Edvin Cetegen ,  Baris Bicen ,  Rahul Manepalli

IPC: H01L23/00 ,  H01L23/522

CPC classification number: H01L23/562 ,  H01L23/5226 ,  H01L24/09 ,  H01L2924/3511

Abstract: An integrated circuit package may be formed comprising a substrate that includes a mold material layer and a signal routing layer, wherein the mold material layer comprises at least one bridge and at least one foam structure embedded in a mold material. In one embodiment, the substrate may include the mold material of the mold material layer filling at least a portion of cells within the foam structure. In a further embodiment, at least two integrated circuit devices may be attached to the substrate, such that the bridge provides device-to-device interconnection between the at least two integrated circuit devices. In a further embodiment, the integrated circuit package may be electrically attached to an electronic board.

公开(公告)号：US11421376B2

公开(公告)日：2022-08-23

申请号：US16072165

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Shawna M. Liff ,  Feras Eid ,  Aleksandar Aleksov ,  Sasha N. Oster ,  Baris Bicen ,  Thomas L. Sounart ,  Valluri R. Rao ,  Johanna M. Swan

IPC: H01L41/047 ,  D06M10/06 ,  D06M11/46 ,  D06M11/47 ,  H01L41/316 ,  D06M17/00 ,  H01L41/087 ,  D06M11/83 ,  H01L41/187 ,  H01L41/29 ,  D01F11/00

Abstract: Embodiments of the invention include an active fiber with a piezoelectric layer that has a crystallization temperature that is greater than a melt or draw temperature of the fiber and methods of forming such active fibers. According to an embodiment, a first electrode is formed over an outer surface of a fiber. Embodiments may then include depositing a first amorphous piezoelectric layer over the first electrode. Thereafter, the first amorphous piezoelectric layer may be crystallized with a pulsed laser annealing process to form a first crystallized piezoelectric layer. In an embodiment, the pulsed laser annealing process may include exposing the first amorphous piezoelectric layer to radiation from an excimer laser with an energy density between approximately 10 and 100 mJ/cm2 and pulse width between approximately 10 and 50 nanoseconds. Embodiments may also include forming a second electrode over an outer surface of the crystallized piezoelectric layer.

公开(公告)号：US20210028084A1

公开(公告)日：2021-01-28

申请号：US16518643

申请日：2019-07-22

Applicant: Intel Corporation

Inventor： Sergio Antonio Chan Arguedas ,  Edvin Cetegen ,  Baris Bicen ,  Aravindha R. Antoniswamy

IPC: H01L23/367 ,  H01L23/00

Abstract: Embodiments may relate to a microelectronic package that includes a die, a thermal interface material (TIM) coupled with the die, and an integrated heat spreader (IHS) coupled with the TIM. The IHS may include a feature with a non-uniform cross-sectional profile that includes a thin point and a thick point as measured in a direction perpendicular to a face of the die to which the TIM is coupled. Other embodiments may be described or claimed.