Invention Grant
- Patent Title: Circuits and methods providing mutual capacitance in vertical electrical connections
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Application No.: US15255412Application Date: 2016-09-02
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Publication No.: US09722012B1Publication Date: 2017-08-01
- Inventor: Priyatharshan Pathmanathan , Devarshi Patel , Dennis Allen Northgrave , Kyle Roberts
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Haynes and Boone, LLP (36340)
- Main IPC: G11C11/40
- IPC: G11C11/40 ; G11C11/24 ; H01L49/02 ; H01L23/498 ; H01L27/108 ; G11C11/401

Abstract:
An electrical device including a structure having a plurality of dielectric layers, the structure further having a plurality of vertical electrical connections extending from a top layer of the dielectric layers to a bottom layer of the dielectric layers, a first vertical electrical connection of the plurality of vertical electrical connections including a first capacitive structure that extends in a plane perpendicular to a vertical dimension of the vertical electrical connection, wherein the first capacitive structure is disposed on a first dielectric layer of the plurality of dielectric layers, wherein the first dielectric layer is below the top layer, and a second vertical electrical connection of the plurality of vertical electrical connections including a second capacitive structure extending in the plane and disposed on the first dielectric layer.
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