Invention Grant
- Patent Title: Isolated gate field effect transistor and manufacture method thereof
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Application No.: US14402525Application Date: 2013-05-21
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Publication No.: US09722064B2Publication Date: 2017-08-01
- Inventor: Kai Cheng
- Applicant: Dynax Semiconductor, Inc.
- Applicant Address: CN Jiangsu
- Assignee: Dynax Semiconductor, Inc.
- Current Assignee: Dynax Semiconductor, Inc.
- Current Assignee Address: CN Jiangsu
- Agency: Blank Rome LLP
- Priority: CN201210173384 20120530
- International Application: PCT/CN2013/075976 WO 20130521
- International Announcement: WO2013/178027 WO 20131205
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/423 ; H01L29/739 ; H01L29/40 ; H01L29/51 ; H01L29/66 ; H01L29/20 ; H01L21/02 ; H01L21/311 ; H01L29/201 ; H01L29/205

Abstract:
An isolated gate field effect transistor and the manufacture method thereof. The isolated gate field effect transistor includes a substrate; a nitride transistor structure arranged on the substrate; a dielectric layer on the nitride transistor structure, where the dielectric layer includes a first dielectric layer, a second dielectric layer and a third dielectric layer and material of the second dielectric layer includes metal; a groove formed in a gate region and at least partially through the dielectric layer; a metal gate formed in the groove; and a source electrode and a drain electrode located at two ohmic contact regions.
Public/Granted literature
- US20150144955A1 Isolated Gate Field Effect Transistor and Manufacture Method Thereof Public/Granted day:2015-05-28
Information query
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