Invention Grant
- Patent Title: Selective solder mask printing on a printed circuit board (PCB)
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Application No.: US15077920Application Date: 2016-03-23
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Publication No.: US09723722B2Publication Date: 2017-08-01
- Inventor: Yehuda Ben-Abu , Yair Ozeri
- Applicant: CAMTEK LTD.
- Applicant Address: IL Migdal Haemeq
- Assignee: CAMTEK LTD.
- Current Assignee: CAMTEK LTD.
- Current Assignee Address: IL Migdal Haemeq
- Agency: Reches Patents
- Main IPC: H05K3/00
- IPC: H05K3/00 ; B41J3/407

Abstract:
A method for printing on a substrate, the method may include determining actual locations of substrate holes; printing a first ink on an object at locations that correspond to the actual locations of the substrate holes and curing the first ink to provide a holes mask; and wherein after the substrate is positioned on the object so that holes mask seals bottoms of the substrate holes then printing the second ink on the substrate thereby forming a predefined pattern on the substrate.
Public/Granted literature
- US20160286659A1 SELECTIVE SOLDER MASK PRINTING ON A PRINTED CIRCUIT BOARD (PCB) Public/Granted day:2016-09-29
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