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公开(公告)号：US20240003826A1
公开(公告)日：2024-01-04
申请号：US18216162
申请日：2023-06-29
Applicant: CAMTEK LTD
Inventor： Carmel Yehuda DRILLMAN , Moshe EDRI , Menachem REGENSBURGER , Baheej BATHISH , Mordi DAHAN
CPC classification number: G01N21/9503 , G01N21/8806 , G01N2021/8825 , H01L22/12
Abstract: A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.
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公开(公告)号：US11828713B1
公开(公告)日：2023-11-28
申请号：US18080006
申请日：2022-12-13
Applicant: CAMTEK LTD
Inventor： Carmel Yehuda Drillman , Moshe Edri , Menachem Regensburger , Baheej Bathish , Mordi Dahan
CPC classification number: G01N21/9503 , G01N21/8806 , G01N2021/8825 , G01N2021/8841 , H01L22/12
Abstract: A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.
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公开(公告)号：US11300521B2
公开(公告)日：2022-04-12
申请号：US16619941
申请日：2018-06-14
Applicant: Camtek Ltd.
Inventor： Menachem Regensburger , Daniel Buzaglo
Abstract: A method for automatic defect classification, the method may include (i) acquiring, by a first camera, at least one first image of at least one area of an object; (ii) processing the at least one first image to detect a group of suspected defects within the at least one area; (iii) performing a first classification process for initially classifying the group of suspected defects; (iii) determining whether a first subgroup of the suspected defects requires additional information from a second camera for a completion of a classification; (iv) when determining that the first subgroup of the suspected defects requires additional information from the second camera then: (a) acquiring second images, by the second camera, of the first subgroup of the suspected defects; and (b) performing a second classification process for classifying the first subgroup of suspected defects.
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4.发明申请公开(公告)号：US20210334946A1
公开(公告)日：2021-10-28
申请号：US16932717
申请日：2020-07-18
Applicant: CAMTEK LTD.
Inventor： Isaac Daniel Buzaglo
Abstract: The present disclosure provides method and system 100 for classifying defects in wafer using wafer defect images, based on deep learning network. Embodiments herein uses synergy between several modalities of the wafer defect images for the classification decision. Further, by adding a mixture of modalities, information may be obtained from different sources such as color image, ICI, the black and white image, to classify the defect image. In addition to mixture of modalities, a reference image may be used for each modality. The reference image of each modality image is provided to deep learning models to concentrate on the defect itself and not on the related underlying lithography of the defect image. Further, the reference image may be provided to the training process of the deep learning models that may significantly reduce the number of labelled images and the training epochs required for convergence of the deep learning model.
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公开(公告)号：US10732128B2
公开(公告)日：2020-08-04
申请号：US16162539
申请日：2018-10-17
Applicant: CAMTEK LTD.
Inventor： Menachem Regensburger
Abstract: There may be provided a method for evaluating an object, that may include evaluating a region of the object by a first evaluation module to provide first evaluation results that are related to multiple sites of the region; finding, using a mapping between values of first evaluation results and values of second evaluation results, (a) a first site of the multiple sites that does not require an evaluation by a second evaluation module, and (b) a second site of the multiple sites that requires an evaluation by the second evaluation module; wherein the second evaluation module is more reliable than the first evaluation module; evaluating the second site by the second evaluation module to provide second evaluation results of the second sites; estimating, based on first evaluation results of the first site and on the mapping, a state of the first site; and providing an evaluation of the region based on the state of the first site, and on the second evaluation result of the second site.
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Patent Agency Ranking
公开(公告)号：US20190033234A1
公开(公告)日：2019-01-31
申请号：US15881777
申请日：2018-01-28
Applicant: Camtek Ltd.
Inventor： Zehava Ben Ezer , Menachem Regensburger , Shimon Koren , Tomer Gilad , Shy Shapira
Abstract: An inspection system for inspecting a semiconductor substrate, the inspection system may include an inspection unit that comprises a partially blocking bright field unit and a non-blocking bright field unit; wherein the partially blocking bright field unit is configured to block any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along a first axis, of an area of the wafer, (b) the specular reflection propagates along a second axis, (c) the first axis and the second axis are symmetrical about a normal to the area of the wafer, and (d) the normal is parallel to an optical axis of the partially blocking bright field unit; and wherein the non-blocking bright field unit is configured to pass to the image plane any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along the first axis, of an area of the wafer, (b) the specular reflection propagates along the second axis, (c) the first axis and the second axis are symmetrical about the normal, and (d) the normal is parallel to the optical axis of the partially blocking bright field unit.
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公开(公告)号：US09989480B2
公开(公告)日：2018-06-05
申请号：US15132323
申请日：2016-04-19
Applicant: CAMTEK LTD.
Inventor： Noam Gordon , Itay Cohen
CPC classification number: G01N21/9515 , G01N2201/0636 , G01N2201/0638 , G02B19/0023 , G02B19/0028 , G02B19/0047 , H04N5/2254 , H04N5/2256 , H04N5/3692
Abstract: An inspection system having an expanded angular coverage, the inspection system may include a line camera; a first curved mirror; a second curved mirror; a first focusing lens that is positioned between the first mirror and an object; a second focusing lens that is positioned between the second mirror and the object; a first light source that is configured to direct a first part of a first light beam towards the first curved mirror and a second part of the first light beam towards the first focusing lens; a second light source that is configured to direct a first part of a second light beam towards the second curved mirror and a second part of the second light beam towards the second focusing lens.
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公开(公告)号：US20160313258A1
公开(公告)日：2016-10-27
申请号：US15132323
申请日：2016-04-19
Applicant: CAMTEK LTD.
Inventor： Noam Gordon , Itay Cohen
CPC classification number: G01N21/9515 , G01N2201/0636 , G01N2201/0638 , G02B19/0023 , G02B19/0028 , G02B19/0047 , H04N5/2254 , H04N5/2256 , H04N5/3692
Abstract: An inspection system having an expanded angular coverage, the inspection system may include a line camera; a first curved mirror; a second curved mirror; a first focusing lens that is positioned between the first mirror and an object; a second focusing lens that is positioned between the second mirror and the object; a first light source that is configured to direct a first part of a first light beam towards the first curved mirror and a second part of the first light beam towards the first focusing lens; a second light source that is configured to direct a first part of a second light beam towards the second curved mirror and a second part of the second light beam towards the second focusing lens.
Abstract translation: 具有扩大的角度覆盖的检查系统，检查系统可以包括线路相机; 第一个曲面镜; 第二个曲面镜; 位于第一反射镜和物体之间的第一聚焦透镜; 位于第二反射镜和物体之间的第二聚焦透镜; 第一光源，其被配置为将第一光束的第一部分朝向第一弯曲镜引导，并且第一光束的第二部分朝向第一聚焦透镜; 第二光源，被配置为将第二光束的第一部分引向第二曲面镜，第二光束的第二部分朝向第二聚焦透镜。
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公开(公告)号：US08573077B2
公开(公告)日：2013-11-05
申请号：US13633142
申请日：2012-10-02
Applicant: Camtek Ltd.
Inventor： Itzik Nisany , Amir Gilead , Michael Vainer , Valery Nuzni
IPC: G01M19/00
CPC classification number: B65G47/905 , H01L21/67288 , H01L21/67778 , H01L21/6838 , H01L21/68707
Abstract: A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.
Abstract translation: 一种用于检查晶片和系统的方法。 该系统包括：卡盘; 以及机器人，其包括连接到可拆卸式适配器的可移动元件，所述可拆卸式适配器选自切割晶片可拆卸适配器和非切割晶片可拆卸适配器的组; 其中切割的晶片可拆卸适配器成形为部分地围绕切割的晶片并且包括适于在支撑切割晶片的带上施加真空的至少一个真空槽; 并且其中所述机器人适于从盒取出所述晶片并将所述晶片放置在所述卡盘上。
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公开(公告)号：US20130115030A1
公开(公告)日：2013-05-09
申请号：US13633142
申请日：2012-10-02
Applicant: Camtek Ltd.
Inventor： Itzik Nisany , Amir Gilead , Michael Vainer , Valery Nuzni
IPC: B65G47/90
CPC classification number: B65G47/905 , H01L21/67288 , H01L21/67778 , H01L21/6838 , H01L21/68707
Abstract: A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.
Abstract translation: 一种用于检查晶片和系统的方法。 该系统包括：卡盘; 以及机器人，其包括连接到可拆卸式适配器的可移动元件，所述可拆卸式适配器选自切割晶片可拆卸适配器和非切割晶片可拆卸适配器的组; 其中切割的晶片可拆卸适配器成形为部分地围绕切割的晶片并且包括适于在支撑切割晶片的带上施加真空的至少一个真空槽; 并且其中所述机器人适于从盒取出所述晶片并将所述晶片放置在所述卡盘上。
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