Invention Grant
- Patent Title: Method for manufacturing substrate having concave pattern, composition, method for forming conductive film, electronic circuit and electronic device
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Application No.: US14888244Application Date: 2014-04-15
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Publication No.: US09746775B2Publication Date: 2017-08-29
- Inventor: Hitoshi Hamaguchi , Kenrou Tanaka , Kenzou Ookita , Keisuke Kuriyama
- Applicant: JSR CORPORATION
- Applicant Address: JP Minato-ku
- Assignee: JSR CORPORATION
- Current Assignee: JSR CORPORATION
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-096179 20130501; JP2014-052520 20140314
- International Application: PCT/JP2014/060694 WO 20140415
- International Announcement: WO2014/178279 WO 20141106
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/038 ; G03F7/36 ; H05K1/02 ; H05K3/12 ; G03F7/38 ; H05K3/10 ; G03F7/004 ; G03F7/16 ; G03F7/20 ; H05K3/28

Abstract:
Provided is a method for manufacturing a substrate having a concave pattern to be used for forming a high-definition pattern while suppressing wet-spreading and bleeding of a film-forming ink, provided is a composition to be used for manufacturing the substrate, and provided are a method for forming a conductive film, an electronic circuit, and an electronic device.The method for manufacturing a substrate having a concave pattern includes: (i) a step of applying, on a substrate 1, a composition containing a polymer having an acid-dissociable group and an acid generator to form a coating film 2 and (ii) a step of irradiating a predetermined portion of the coating film 2 with radiation. The method for forming a conductive film includes applying a conductive film-forming ink on the concave pattern formed in the exposed portion of the coating film 2 and heating the ink to form a pattern 6. The electronic circuit and the electronic device are provided by using the method for forming a conductive film.
Public/Granted literature
Information query
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