Invention Grant
- Patent Title: Deposition method
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Application No.: US14626220Application Date: 2015-02-19
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Publication No.: US09752227B2Publication Date: 2017-09-05
- Inventor: Eiji Fuchita , Eiji Tokizaki , Eiichi Ozawa
- Applicant: Fuchita Nanotechnology Ltd.
- Applicant Address: JP Chiba
- Assignee: FUCHITA NANOTECHNOLOGY LTD.
- Current Assignee: FUCHITA NANOTECHNOLOGY LTD.
- Current Assignee Address: JP Chiba
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: JP2014-130348 20140625; JP2014-258652 20141222
- Main IPC: B05D1/00
- IPC: B05D1/00 ; C23C14/34 ; H01J37/34 ; C09D5/00 ; C23C24/02 ; B05D1/12 ; B05D1/06

Abstract:
A deposition method includes: introducing a gas into an airtight container containing electrically insulated raw material particles to generate an aerosol of the raw material particles; transferring the aerosol to a deposition chamber through a transfer tubing connected to the airtight container, the deposition chamber having a pressure maintained to be lower than that of the airtight container; injecting the aerosol from a nozzle mounted on a tip of the transfer tubing toward a target placed on the deposition chamber to cause the raw material particles to collide with the target, thereby causing the raw material particles to be positively charged; generating fine particles of the raw material particles by discharge of the charged raw material particles; and depositing the fine particles on a substrate placed on the deposition chamber.
Public/Granted literature
- US20150376771A1 DEPOSITION METHOD, DEPOSITION APPARATUS, AND STRUCTURE Public/Granted day:2015-12-31
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