Invention Grant
- Patent Title: Electrostatic multipole device, electrostatic multipole arrangement, and method of manufacturing an electrostatic multipole device
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Application No.: US14947241Application Date: 2015-11-20
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Publication No.: US09754759B2Publication Date: 2017-09-05
- Inventor: Benjamin John Cook , Dieter Winkler
- Applicant: ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH
- Applicant Address: DE Heimstetten
- Assignee: ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH
- Current Assignee: ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH
- Current Assignee Address: DE Heimstetten
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01J37/12
- IPC: H01J37/12 ; H01J37/147

Abstract:
An electrostatic multipole device for influencing a charged particle beam propagating along an optical axis is described. The electrostatic multipole device comprises a substrate with at least one aperture opening for the charged particle beam, which extends along the optical axis through the substrate, and four or more electrodes which are formed on a first main surface of the substrate to influence the charged particle beam propagating through the aperture opening, wherein each of the four or more electrodes is arranged at a radial distance from a beam limiting edge of the aperture opening. Further, a method of manufacturing an electrostatic multipole device is described.
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