Invention Grant
- Patent Title: Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof
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Application No.: US15071368Application Date: 2016-03-16
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Publication No.: US09754870B2Publication Date: 2017-09-05
- Inventor: Ting-Hao Lin , Yi-Fan Kao , Shuo-Hsun Chang , Yu-Te Lu , Kuo-Chun Huang
- Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
- Applicant Address: TW Shin-Wu Shiang Taoyuan County
- Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
- Current Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
- Current Assignee Address: TW Shin-Wu Shiang Taoyuan County
- Agency: Idea Intellectual Limited
- Agent Margaret A. Burke; Sam T. Yip
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H05K3/46 ; H01L23/00 ; H01L25/10 ; H05K1/02 ; H05K1/18
Abstract:
A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate with a penetrating rectangular opening bonded to a non-conductive film then a carrier board in order to form a compound carrier board structure. The baseplate is constructed with a low Thermal Expansion Coefficient material.
Public/Granted literature
- US20160197033A1 COMPOUND CARRIER BOARD STRUCTURE OF FLIP-CHIP CHIP-SCALE PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-07-07
Information query
IPC分类:
