Invention Grant
- Patent Title: High efficiency FinFET diode
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Application No.: US15076205Application Date: 2016-03-21
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Publication No.: US09755075B2Publication Date: 2017-09-05
- Inventor: Hsueh-Shih Fan , Ching-Fang Huang , Chia-Hsin Hu , Min-Chang Liang , Sun-Jay Chang , Shien-Yang Wu , Wen-Hsing Hsieh
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L29/78 ; H01L21/8238 ; H01L29/165 ; H01L29/66 ; H01L29/861 ; H01L21/02 ; H01L21/265 ; H01L29/16 ; H01L29/161 ; H01L29/201 ; H01L27/092

Abstract:
Disclosed are methods to form a FinFET diode of high efficiency, designed to resolve the degradation problem with a conventional FinFET diode arising from reduced active area, and a method of fabrication. The FinFET diode has a doped substrate, two spaced-apart groups of semiconductor fin structures, dielectric layers formed between the two groups and among the fin structures for insulation, a plurality of gate structures perpendicularly traversing both groups of the fin structures, and two groups of semiconductor strips respectively formed lengthwise upon the two groups of the fin structures. The two groups of semiconductor strips are doped to have opposite conductivity types, p-type and n-type. In an embodiment, the FinFET diode further has metal contacts formed upon the semiconductor strips. In another embodiment, the semiconductor strips may be integrally formed with the fin structures by epitaxial growth and in-situ doped.
Public/Granted literature
- US20160204259A1 HIGH EFFICIENCY FINFET DIODE Public/Granted day:2016-07-14
Information query
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