A substrate structure includes a dielectric layer, a metal foil, a patterned metal layer, a first patterned solder-resist layer, a release layer and a second patterned solder-resist layer. The dielectric layer includes a first surface having a plurality of recesses and a second surface. The metal foil is disposed on the second surface. The patterned metal layer is disposed on the first surface, the patterned metal layer has a plurality of openings, and the openings are respectively corresponding to and expose the recesses. The first patterned solder-resist layer is filled in each of the recesses and corresponding to each of the openings. A top surface of the first patterned solder-resist layer is substantially coplanar with a top surface of the patterned metal layer. The second patterned solder-resist layer is disposed on the first patterned solder-resist layer and in the openings, and covers a portion of the patterned metal layer.