Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs
Abstract:
Prepregs having a UV curable resin layer located adjacent to a thermally curable resin layer wherein the UV curable resin layer includes at least one UV cured resin portion and at least one UV uncured resin as well as methods for preparing flexible printed circuit boards using the prepregs.
Information query
Patent Agency Ranking
0/0