Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15225457Application Date: 2016-08-01
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Publication No.: US09780036B2Publication Date: 2017-10-03
- Inventor: Ki Hong Lee , Seung Ho Pyi , Jin Ho Bin
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2013-0032372 20130326
- Main IPC: H01L23/532
- IPC: H01L23/532 ; H01L29/792 ; H01L29/66 ; H01L29/788 ; H01L21/764 ; H01L27/115 ; H01L27/11556 ; H01L27/11565 ; H01L27/11582 ; H01L21/768 ; H01L23/522 ; H01L23/528 ; H01L27/11517 ; H01L27/11563 ; H01L27/11519
Abstract:
A semiconductor device may include pillars and a plurality of conductive layers being stacked while surrounding the pillars and including a plurality of first regions including non-conductive material layers and a plurality of second regions including conductive material layers, wherein the first regions and the second regions are alternately arranged.
Public/Granted literature
- US20160343669A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-11-24
Information query
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