Invention Grant
- Patent Title: Printed circuit board
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Application No.: US14438666Application Date: 2013-05-09
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Publication No.: US09781835B2Publication Date: 2017-10-03
- Inventor: Won Suk Jung , Kyu Won Lee , Yun Ho An , Woo Young Lee
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: LRK Patent Law Firm
- Priority: KR10-2012-0123386 20121102
- International Application: PCT/KR2013/004112 WO 20130509
- International Announcement: WO2014/069734 WO 20140508
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/03 ; H05K1/16 ; H05K3/30 ; H05K3/46 ; H01L23/00 ; H05K1/02 ; H05K1/11 ; H01L23/498 ; H01L21/48 ; H01L23/538 ; H01L23/31
Abstract:
Provided is a printed circuit board including: an insulating layer; electronic devices embedded in the insulating layer; and an adhesive layer for fixing the electronic devices.
Public/Granted literature
- US20150296625A1 PRINTED CIRCUIT BOARD Public/Granted day:2015-10-15
Information query
