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    PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME 有权
    印刷电路板及其制造方法

    公开(公告)号：US20150257262A1

    公开(公告)日：2015-09-10

    申请号：US14432278

    申请日：2013-10-04

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Sang Myung Lee ,  Byeong Ho Kim ,  Jae Seok Park ,  Yeong Uk Seo ,  Hyun Seok Seo ,  Chang Woo Yoo ,  Kyu Won Lee

    IPC: H05K1/03 ,  H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/0346 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/115 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/4007 ,  H05K3/465 ,  H05K2201/0367 ,  H05K2201/096 ,  H05K2203/041

    Abstract: A printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.

    Abstract translation: 一种印刷电路板包括：包含各向同性树脂的芯绝缘层，填充在芯绝缘层的上部或下部的电路图形槽中的第一电路图案，在其顶表面上设置有第一绝缘层， 电路图案槽并覆盖第一电路图案，以及第二电路图案，以填充第一绝缘层的电路图案槽。 对于芯绝缘层使用具有各向同性结构的材料，例如聚酰亚胺，从而防止基板在没有玻璃纤维的情况下弯曲。 由于不包括玻璃纤维，因此在芯绝缘层的上部或下部形成掩埋图案，从而制造薄基板。

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
    印刷电路板及其制造方法

    公开(公告)号：US20150062846A1

    公开(公告)日：2015-03-05

    申请号：US14383365

    申请日：2013-02-25

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Ji Su Kim ,  Ki Do Chun ,  Kyu Won Lee ,  Sang Myung Lee

    IPC: H05K3/46 ,  H05K3/10 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03

    CPC classification number: H05K3/4602 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/107 ,  H05K3/465 ,  H05K3/4697 ,  H05K2201/017 ,  H05K2201/0195 ,  H05K2201/20

    Abstract: Provided is a printed circuit board, including: a core substrate including an internal circuit pattern on an upper surface or a lower surface; electronic devices which are formed to pass through the core substrate; an external insulating layer which covers the internal circuit pattern and the electronic devices; and an external circuit pattern which is formed on an upper surface of the external insulating layer, wherein a lower surface of the electronic devices protrudes from the lower surface of the core substrate to a lower part. Accordingly, in the embedded printed circuit board in which the electronic devices are embedded, when the electronic devices are mounted, because the insulating layer is formed regardless of a thickness of the electronic devices, the printed circuit board having a desired thickness regardless of the thickness of the electronic devices can be formed.

    Abstract translation: 提供一种印刷电路板，包括：在上表面或下表面上包括内部电路图案的芯基板; 形成为通过芯基板的电子器件; 覆盖内部电路图案和电子设备的外部绝缘层; 以及外部电路图案，其形成在所述外部绝缘层的上表面上，其中所述电子设备的下表面从所述芯基板的下表面突出到下部。 因此，在嵌入电子器件的嵌入式印刷电路板中，当安装电子器件时，由于形成绝缘层而与电子器件的厚度无关地形成印刷电路板，而与厚度无关，印刷电路板 的电子设备可以形成。

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